Since the costs cannot be met for mobile and wearable applications a lot of alternative technologies are developed to close this gap, mainly contributed by WL-FOP approaches. Yole highlighted very well the wiring gap between the 10/10µ and 1/1µ line spacing, which is currently closed by silicon interposer technology. The immense costs of silicon interposers which are needed for 2.5D packages can be justified in the HPC world (CPUs, GPUs, network processors, …). A lot of activities are driven from the current cost issues of Advanced Packaging approaches. It is the community of the platforms that have been listed above. HB: If we can trust Yole’s perspectives then it is not one single platform that drives further Besi growth. YD: Which Advanced Packaging platform do you see a high interest for further growth of Besi revenue? What changes do you expect in the future? All these aspects allow an evident conclusion that Besi is very well positioned in the Advanced Packaging sector. In addition to die bonders and molding systems Besi has successfully introduced Fico singulation solutions for Advanced Packaging, supporting also some options for EMI shielding technology which is key for SiP packages. But also in the Advanced SiP segment where component-to-component spacing is approaching 50µm gaps Besi molding systems are well in place.
![datacon 2200 evo plus datacon 2200 evo plus](https://sg.all.biz/img/sg/catalog/17228.jpeg)
Many people of the Advanced Packaging society have been surprised with the outstanding capability of Fico molding systems for transfer mold based wafer level molding, supporting both molded underfill and exposed die.
![datacon 2200 evo plus datacon 2200 evo plus](https://img.directindustry.com/images_di/photo-mg/13795-15506679.jpg)
Initially introduced for strip-level the Fico molding solutions are now also available for wafer level applications, which are main target for Advanced Packaging approaches. The Fico molding systems have excellent capabilities for molded underfill and exposed die molding. Finally the SiP world is covered by the Datacon 2200 EVO work horse, a multi chip bonder from its beginning, supporting flip & non-flip attach, including SMD and odd components.īesides die bonding equipment Besi has strong solutions for molding. The platform is prepared for take-off of the 2.5D applications. For the 2.5D/3D applications Besi has the major share of productivity for 3D memory cubes TC Bonding (8800 TC bonder). Besi’s wallet share for eWLB bonder equipment is still close to 100%.
#DATACON 2200 EVO PLUS SERIES#
For FO-WLP Besi introduced the Datacon 8800 CHAMEO series for the Infineon eWLB process. On the die bonder portfolio Besi is leading the mass reflow flip chip bonder market with Datacon 8800 solutions, majorly installed at Asian OSATs. HP: Using Yole’s language the Advanced Packaging landscape is coarsely divided into Flip Chip, FO-WLP, 2.5D/3D and SiP. YD: As one of the leading suppliers of the semiconductor area, can you explain how Besi is positioned in the Advanced Packaging sector? Besi has a strategic focus on Advanced Packaging equipment. Since 1995, when Besi became a public company, Besi has grown from being a local Dutch system and tooling manufacturer to a world’s leading semiconductor assembly equipment manufacturer, holding now famous backend equipment brands like Fico, Meco, Datacon and Esec.Ĭustomers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.
![datacon 2200 evo plus datacon 2200 evo plus](https://priceslasopa672.weebly.com/uploads/1/2/5/8/125839493/224339426.jpg)
The Company develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. Hugo Pristauz: Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Yole Développement: Can you please introduce Besi product line, its history and current activity ? Learn more about BESI activities and the evolution of the Chinese subcontractor landscape…
![datacon 2200 evo plus datacon 2200 evo plus](https://www.besi.com/uploads/tx_besi/besi-Datacon-2200-evo-advanced56174_1000.jpg)
Hugo Pristauz, BESI Vice President Technical Development Advanced Technology DA, shared with us its view on the evolution of the die bonding, die singulation and molding solutions in addition to the strategy of the Chinese subcontractor in order to be able to compete with their Taiwanese and Korean competitors. Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership.